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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT24CM01-WWU27M
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT24CM01-WWU7M
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT24CM01-WWU11M
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT24CM01-SHM-T
0.135700
0.390476
8
SOIJ
.208in
NiPdAu
e4
download
AT24CM01-SHD-T-989
0.135700
0.390476
8
SOIJ
.208in
NiPdAu
e4
download
AT24CM01-SHM-B
0.135700
2.700000
8
SOIJ
.208in
NiPdAu
e4
download
AT24CM01-SHD-T
0.135700
0.390476
8
SOIJ
.208in
NiPdAu
e4
download
AT24CM01-SHD-B
0.135700
2.700000
8
SOIJ
.208in
NiPdAu
e4
download
AT24CM01-XHD-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24CM01-XHD-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24CM01-XHM-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24CM01-XHM-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24CM01-SSHM-T-834
0.075000
0.250000
8
SOIC
3.90mm(.1China RoHs 50.pngin)
NiPdAu
e4
download
AT24CM01-U1UMGY-T
0.002800
0.000000
8
WLCSP
1.921x2.295x0.3964mm
SAC405
e1
download
AT24CM01-UUM-T
0.004100
0.000000
8
WLCSP
2.32x1.946x0.538mm
SAC405
e1
download
AT24CM01-U2UMHJ-T
0.001900
0.000000
8
WLCSP
1.921x2.295x0.29mm
SAC405
e1
download
AT24CM01-U1UMGY-T-020
0.002800
0.000000
8
WLCSP
1.921x2.295x0.3964mm
SAC405
e1
download
AT24CM01-UUMJC-T-923
0.004100
0.000000
8
WLCSP
2.32x1.946x0.538mm
SAC405
e1
download
AT24CM01-SSHM-T
0.078000
0.230303
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
AT24CM01-SSHD-T
0.078000
0.230303
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
AT24CM01-SSHD-B
0.078000
0.250000
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
AT24CM01-SSHM-B
0.078000
0.250000
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
AT24CM01-SSHM-T-989
0.078000
0.230303
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download