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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT24C16D-WWU27M
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT24C16D-WWU11M
0.000000
1000.000
0
Wafer
Varies
-
-
 
AT24C16D-CUM-T
0.004400
0.000000
8
VFBGA
1.5x2x0.85mm
SAC405
e1
download
AT24C16D-XHM-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24C16D-XHM-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24C16D-MAHM-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT24C16D-MAHM-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT24C16D-STUM-T
0.011900
0.199200
5
TSOT
1.6x2.9x1.1mm
Matte Tin
e3
download
AT24C16D-UUM0B-T
0.000300
0.070000
4
WLCSP
0.643x0.797x0.33mm
SAC405
e1
download
AT24C16D-SSHM-T
0.078000
0.230303
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
AT24C16D-SSHM-B
0.078000
0.250000
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
AT24C16D-PUM
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download