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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT24C02C-XHM-T-537
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24C02C-XHM-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24C02C-XHM-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24C02C-XHMAU-T-346
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
download
AT24C02C-MAHM-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT24C02C-MAHM-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
download
AT24C02C-SSHM-T-899
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT24C02C-SSHM-T-989
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT24C02C-STPD-TVAO
0.011900
0.199200
5
TSOT
1.6x2.9x1.1mm
Matte Tin
e3
download
AT24C02C-SSHM-B
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT24C02C-SSHM-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT24C02C-SSHM-T-441
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT24C02C-SSHM-T-537
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
AT24C02C-STUM-T
0.016000
0.049000
5
SOT-23
-
Matte Tin
e3
download
AT24C02C-PUM
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download