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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
AT21CS11-SSH10-B
0.075000
0.163265
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT21CS11-SSH10-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
download
AT21CS11-MSH10-T
0.020300
0.020200
2
XSFN
5x3.5x0.4mm
NiPdAu
e4
download
AT21CS11-MSH10-B
0.020300
0.150000
2
XSFN
5x3.5x0.4mm
NiPdAu
e4
download
AT21CS11-STU10-T
0.008300
0.039000
3
SOT-23
1.3mm
Matte Tin
e3
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