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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
93AA66C-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
93AA66CT-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
93AA66CT-I/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
93AA66CT-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
93AA66C-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
93AA66CT-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
93AA66C-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
93AA66CT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
93AA66CX-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
93AA66CXT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
93AA66C-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download