Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
93AA56B-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
93AA56BT-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
93AA56BT-I/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
93AA56BT-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
93AA56B-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
93AA56BT-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
93AA56B-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
93AA56BT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
93AA56BX-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
93AA56BXT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
93AA56BT-I/OT
0.017000
0.046667
6
SOT-23
-
Matte Tin
e3
download
93AA56B-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download