Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
25LC640/S
0.000000
1000.000
0
DICE
Varies
-
-
 
25LC640/W
0.000000
1000.000
0
WAFER
Varies
-
-
 
25LC640/WF
0.000000
1000.000
0
WAFER
Varies
-
-
 
25LC640X-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
25LC640XT-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
25LC640-E/SN
0.078000
0.250000
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
25LC640-I/SN
0.078000
0.250000
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
25LC640T-E/SN
0.078000
0.230303
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
25LC640T-I/SN
0.078000
0.230303
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
25LC640-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
25LC640-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
25LC640-I/PREL
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download