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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
25LC1024-I/S16K
0.000000
1000.000
0
DICE
Varies
-
-
 
25LC1024-I/W16K
0.000000
1000.000
0
WAFER
Varies
-
-
 
25LC1024-I/WF16K
0.000000
1000.000
0
WAFER
Varies
-
-
 
25LC1024-E/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
download
25LC1024-E/SM16KVAO
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
download
25LC1024-I/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
download
25LC1024-I/SMA23
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
download
25LC1024T-E/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
download
25LC1024T-E/SM16KVAO
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
download
25LC1024T-I/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
download
25LC1024T-I/SMA23
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
download
25LC1024-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
25LC1024-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
25LC1024-E/MF
0.076900
0.133333
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
25LC1024-I/MF
0.076900
0.133333
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
25LC1024T-E/MF
0.076900
0.218182
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
25LC1024T-I/MF
0.076900
0.218182
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download