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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
25AA512-I/S16K
0.000000
1000.000
0
DICE
Varies
-
-
 
25AA512-I/S0816K
0.000000
1000.000
0
DICE
Varies
-
-
 
25AA512-I/W0816K
0.000000
1000.000
0
WAFER
Varies
-
-
 
25AA512-I/W16K
0.000000
1000.000
0
WAFER
Varies
-
-
 
25AA512-I/WF16K
0.000000
1000.000
0
WAFER
Varies
-
-
 
25AA512-I/WF0816K
0.000000
1000.000
0
WAFER
Varies
-
-
 
25AA512-I/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
download
25AA512T-I/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
download
25AA512-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
25AA512T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
25AA512T-I/SN16KVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
25AA512T-I/SN-SCI
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
25AA512-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
25AA512-I/MF
0.076900
0.133333
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
25AA512T-I/MF
0.076900
0.218182
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download