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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
24FC512-I/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
download
24FC512T-I/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
download
24FC512T-I/SMRVE
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
download
24FC512-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
24FC512-I/ST14
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
download
24FC512-I/ST16KVAO
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
24FC512T-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
24FC512T-I/ST16KVAO
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
24FC512T-I/ST14
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
download
24FC512-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC512-I/SN16KVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC512T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC512-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
24FC512-I/MF
0.076900
0.133333
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
24FC512T-I/MF
0.076900
0.218182
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download