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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
24FC16T-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
24FC16-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
24FC16T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
24FC16-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
24FC16-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC16H-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC16T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC16HT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC16-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC16H-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC16T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24FC16HT-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download