Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
24AA04H-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
24AA04HT-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
24AA04HT-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
24AA04H-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
24AA04HT-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
24AA04H-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24AA04HT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24AA04HT-I/OT
0.016000
0.049000
5
SOT-23
-
Matte Tin
e3
download
24AA04H-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download