Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
24AA025T-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
24AA025-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
24AA025-I/MC
0.015600
0.033333
8
DFN
2x3x0.9mm
Matte Tin
e3
download
24AA025T-I/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
24AA025T-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
24AA025-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
24AA025T-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
24AA025-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24AA025T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24AA025T-I/OT
0.017000
0.046667
6
SOT-23
 
Matte Tin
e3
download
24AA025-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download