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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
24AA01H-I/S16K
0.000000
1000.000
0
DICE
Varies
-
-
 
24AA01H-I/W16K
0.000000
1000.000
0
WAFER
Varies
-
-
 
24AA01H-I/WF16K
0.000000
1000.000
0
WAFER
Varies
-
-
 
24AA01H-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
24AA01HT-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
24AA01HT-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
24AA01HT-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
download
24AA01H-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
download
24AA01H-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24AA01HT-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
24AA01HT-I/LT
0.006300
0.033333
5
SC70
 
Matte Tin
e3
download
24AA01HT-I/OT
0.016000
0.049000
5
SOT-23
 
Matte Tin
e3
download
24AA01H-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download