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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
11LC161-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
11LC161-I/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
11LC161T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
11LC161T-I/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
11LC161T-E/MC
0.015600
0.130606
8
DFN
2x3x0.9mm
Matte Tin
e3
download
11LC161T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
11LC161T-I/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
download
11LC161-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
11LC161-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
11LC161T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
11LC161T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
11LC161T-E/TT
0.008300
0.039000
3
SOT-23
1.3mm
Matte Tin
e3
download
11LC161T-I/TT
0.008300
0.039000
3
SOT-23
1.3mm
Matte Tin
e3
download
11LC161-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
11LC161-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
11LC161-I/TO
0.203400
0.219000
3
TO-92
-
Matte Tin
e3
download