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AN2091

Title:
Package Application Note for WLCSP Packages
Name:
AN2091
Date:
04/22/2019
Author:
Simeon Iliev
Description:
This package application note provides the guidelines for the handling and assembly of Microchip WLCSP packages during the Printed Circuit Board (PCB) assembly. In addition, it provides general information for the PCB land pattern design and component rework guidelines.
Keywords:
WLCSP, package application note
 
Application Notes & Source Code
 Last Updated
Size
 
  AN2091
  04/27/2019
  393KB
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