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Memo # ML062019000A: End of Life (EOL) of ATXMEGA256A3B-AU, ATXMEGA256A3B-AUR, ATXMEGA128D4-M7, ATXMEGA128A4U-AN, ATXMEGA128D4-AN, ATXMEGA64A4U-AN, ATXMEGA64D4-AN, ATXMEGA128C3-AN, ATXMEGA128D3-AN, ATXMEGA128C3-ANR ATXMEGA128D3-ANR Atmel catalog part numbers (CPN).
06-Jun-2019
      
CCB 3496 and 3496.001 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel products of the 35.4K, 35.5K and 35.9K wafer technologies available in 64L TQFP (14x14x1.0mm) and 100L TQFP (14x14x1.0mm) packages.
04-Mar-2019
    
CCB 3631 Initial Notice: Qualification of ASSH as a new assembly site for selected Atmel ATXMEGA products available in 64L VQFN (7x7x1mm) package.
19-Dec-2018
    
CCB 3417 Final Notice: Implement Base Quantity Multiple (BQM) changes to selected Atmel Products.
11-Oct-2018
    
Data Sheet - ATxmega128A1U/62A1U Data Sheet
30-Aug-2018
    
Data Sheet - ATxmega32E5/16E5/8E5 - Complete Datasheet
30-Aug-2018
    
CCB 3051 Final Notice: Qualification of ASE as an additional assembly site for selected Atmel products available in 100L TFBGA (9x9mm) package
02-Jun-2018
    
CCB 2913 Final Notice: Qualification of MTAI as an additional assembly site for selected Atmel products available in 32L TQFP (7x7x1 mm) package using CuPdAu bond wire.
06-Oct-2017
    
CCB 2976 Final Notice: Qualification palladium coated copper (PdCu) bond wire for selected Atmel products available in 100L TFBGA package (9x9mm) at LPI assembly site.
17-Aug-2017
    
CRS 16-1150 Final Notice: Qualification of New Carrier Tape Design for all Atmel MCU products available in 64L and 100L TQFP 14X14 package shipped from MPHIL.
12-Apr-2017
      
Adding Copper Bonding Wire Capability for Selected Microcontrollers
22-Oct-2015
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
30-Jul-2015
  
Qualification of JCAP as Additional Source of WLCSP Assembly and Test
26-May-2015
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
17-Apr-2015
  
Change in Package Marking for Selected AVR XMEGA D4/D3/A4U Microcontrollers
11-Sep-2014
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
06-Jun-2014
  
Convert MSL3 to MSL1 for QFN Packages
26-Mar-2014
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
17-Oct-2013
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
20-Aug-2013
  
Die Revision Change for ATxmega64D3
26-Jul-2013
  
Die Revision Change for ATxmega16D4 / ATxmega32D4
19-Jun-2013
  
Convert MSL3 to MSL1 for QFN Packages
10-Jun-2013
  
Die Revision Change for ATxmega128D3
29-Apr-2013
  
Die Revision Change for ATxmega256D3
24-Apr-2013
  
Die Revision Change for ATxmega192D3
24-Apr-2013
  
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