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Product Change Notifications



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Notification ID
Notification subject
Date Sent
Documents
CCB 3331 Final Notice: Qualification of MPHL as a new final test site for selected Atmel products available in 28L SDIP (.300in) package.
17-Jun-2019
    
CCB 3397 Final Notice: Qualification of MPHL as an additional final test site for selected Atmel products available in 32L VQFN package.
14-Jun-2019
      
CCB 3702 and 3702.001 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach and G700LTD mold compound material for selected Atmel products of the 35.4K and 35.5K wafer technologies available in 32L and 64L VQFN packages at NSEB assembly site.
22-Mar-2019
    
CCB 3368 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel products available in 32L VQFN (5x5x0.9) package
28-Feb-2019
    
CCB 3600, 3600.001-3600.003 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected Atmel products of the 35.4K, 35.5K and 35.8K wafer technologies available in 40L PDIP, 20L PDIP, 8L PDIP and 28L SPDIP packages.
12-Nov-2018
    
CCB 3370.001 Final Notice: Qualification of MMT as a new assembly site in selected Atmel products of 19.6K, 35.4K and 35.5K wafer technologies available in 32L VQFN package using palladium coated copper wire with gold flash (CuPdAu) bond wire.
02-Oct-2018
    
CCB 3549 Initial Notice: Qualification of MPHL as an additional final test site for selected Atmel ATMEGA and ATTINY products available in 32L VQFN package.
17-Sep-2018
    
CCB 3104.001 Final Notice: Qualification of MTAI as an additional final test site for selected Atmel ATmega and ATTiny products available in 32L TQFP (7x7x1.0mm) package.
12-Sep-2018
    
Data Sheet - ATmega328PB Automotive - Complete Data Sheet
23-Aug-2018
    
CCB 3211 Cancellation Notice: For the qualification of MTAI as an additional assembly site for selected Atmel products available in 32L VQFN package using palladium coated copper wire with gold flash (CuPdAu) bond wire.
01-Aug-2018
  
CCB 3210 Final Notice: Qualification of MTAI as a new assembly site for selected Atmel Products available in 32L VQFN package using gold (Au) bond wire
04-Jul-2018
    
CCB 2856 Final Notice: Qualification of Microchip Fabrication site (FAB 4) for selected Atmel products manufactured with the 59.91K process technology.
25-Jun-2018
    
CCB 3166.002 Final Notice: Qualification of MMT as new assembly site for selected Atmel products available in 28L PDIP package using gold (Au) bond wire
13-Mar-2018
    
Memo # ML022018006J Final Notice: Production Test Program Change for selected products of the DSPIC33EP128GMxxx, DSPIC33EP256GMxxx and DSPIC33EP512GMxxx device families.
05-Mar-2018
  
Data Sheet - ATmega328PB - Complete Datasheet Data Sheet Document Revision
27-Feb-2018
    
CCB 2995 Final Notice: Qualification of UMC5 as an additional fabrication site for Atmel ATMEGA328PB device families manufactured with the 59.91K process technology.
30-Jan-2018
    
Data Sheet - ATmega328PB - Complete Datasheet
15-Jan-2018
    
CCB 2913 Final Notice: Qualification of MTAI as an additional assembly site for selected Atmel products available in 32L TQFP (7x7x1 mm) package using CuPdAu bond wire.
06-Oct-2017
    
CCB 3104 Initial Notice: Qualification of MTAI as an additional Final Test site for selected Atmel ATMEGA products available in 32L TQFP package
23-Sep-2017
    
CRS 15-1915 Final Notice: Implement silicon die revision C for ATMEGA328PB Atmel device families
20-Jun-2017
  
Data Sheet - ATmega328PB - Complete Datasheet
09-Jun-2017
    
Adding Copper Bonding Wire Capability for Selected Microcontrollers
11-Sep-2014
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
23-Jul-2014
  
Convert MSL3 to MSL1 for QFN Packages
26-Mar-2014
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
17-Oct-2013
  
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