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Product Change Notifications



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Notification ID
Notification subject
Date Sent
Documents
CCB 3654 Initial Notice: Qualification of MMT as an additional assembly site for selected Atmel products of 58.5K and 58.85K wafer technologies available in 48L VQFN (7x7x0.9mm) package.
27-Dec-2018
    
Data Sheet - ATmega164A/PA/324A/PA/644A/PA/1284/P - Summary Datasheet
11-Dec-2018
    
CCB 3600, 3600.001-3600.003 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected Atmel products of the 35.4K, 35.5K and 35.8K wafer technologies available in 40L PDIP, 20L PDIP, 8L PDIP and 28L SPDIP packages.
12-Nov-2018
    
CCB 3545 Final Notice: Implement MMT shipping tube for selected Atmel products available in 20L PDIP (300 mils), 28L PDIP, 40L PDIP (600 mils), 28L PLCC and 44L PLCC packages.
19-Sep-2018
    
CCB 3517 Final Notice: Qualification of MTAI as an additional final test site for selected Atmel ATmega products available in 44L TQFP (10x10x1.0mm) package.
23-Aug-2018
    
CCB 3296 Final PCN: Qualification of gold (Au) bond wire as secondary wire material for selected Atmel products available in 44L TQFP (10x10x1.0mm) package at MTAI Assembly site
07-Aug-2018
    
CCB 3156, 3156.001, 3166 and 3166.001 Final Notice: Qualification of MMT as a new assembly site for selected Atmel products available in 8L, 20L and 40L PDIP packages.
12-Feb-2018
    
Fab and Assembly Location Change for ATmegaXXXRFR2
25-Nov-2014
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
23-Jul-2014
  
Convert MSL3 to MSL1 for QFN Packages
26-Mar-2014
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
17-Oct-2013
  
Convert MSL3 to MSL1 for QFN Packages
10-Jun-2013
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
11-Mar-2013
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
31-Jan-2013
  
Addition of ASE, Shanghai (ASESH) for Assembly and Package Testing for the 40L PDIP for the Microcontroller, EPROM and EPLD Product Families
21-Jul-2010
  
Qualification of Package Testing for Microcontroller 44VQFN 7x7 at ASE Chung-Li (ASECL)
22-Oct-2009
  
Addition of ASE (KH) Taiwan for Microcontroller 44TQFP Package Test
18-Feb-2009
  
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