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Product Change Notifications



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Date Sent
Documents
CCB 3257.001 Final Notice: Qualification of MTAI as an additional assembly site for selected Atmel ATTINYXX automotive products in 35.5K wafer technology available in 8L SOIJ package
14-Nov-2019
    
CCB 3257 Final Notice: Qualification of MTAI as an additional assembly site for selected Atmel ATTINYXX non-automotive products in 35.4k and 35.5K wafer technology available in 8L SOIJ package.
12-Feb-2019
    
Adding Copper Bonding Wire Capability for Selected Microcontrollers
23-Jul-2014
  
Convert MSL3 to MSL1 for QFN Packages
26-Mar-2014
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
17-Oct-2013
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
20-Sep-2013
  
Addition of UTAC (UTL3 Thailand) Final Test Location for ATTinyx5 20QFN Product Family
12-Apr-2012
  
Moisture Sensitivity Level 1 For Automotive Devices In SO 8 Leads Package
02-Dec-2010
  
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