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Product Change Notifications



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Notification ID
Notification subject
Date Sent
Documents
CCB 4031 Initial Notice: Qualification of Microchip Technology Tempe – Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.
22-Jan-2020
    
CCB 4039 Initial Notice: Qualification of Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.
18-Jan-2020
    
CCB 3296 Final PCN: Qualification of gold (Au) bond wire as secondary wire material for selected Atmel products available in 44L TQFP (10x10x1.0mm) package at MTAI Assembly site
07-Aug-2018
    
Adding Copper Bonding Wire Capability for Selected Microcontrollers
19-Dec-2014
  
Adding Copper Bonding Wire Capability for Selected Microcontrollers
06-Jun-2014
  
Convert MSL3 to MSL1 for QFN Packages
26-Mar-2014
  
Addition of UTAC Thailand for the ATMEGA16U4 & ATMEGA32U4 44 QFN Final Test
22-Aug-2011
  
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