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Product Change Notifications



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Notification ID
Notification subject
Date Sent
Documents
CCB 3814 Final Notice: Qualification of G631H mold compound material for selected Micrel products available in 128L PQFP (14x20x2.72mm) package at ASE assembly site
16-Aug-2019
    
CCB 3633 Final Notice: Qualification of G700HA mold compound material for selected products of the 0.25um TSMC and 0.35um TSMC wafer technologies available in 44L TQFP (10x10x1.0 mm) package at MTAI assembly site.
16-Aug-2019
    
CCB 3074 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 200K wafer technology available in 8L DFN (2x3x0.9mm) package at NSEB assembly site
15-Aug-2019
    
CCB 3042 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond in selected products of the 200K wafer technology available in 8L DFN (3x3x0.9mm) package at NSEB assembly site
15-Aug-2019
    
CCB 3027 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products of the 0.18um TSMC wafer technology available in 44L QFN (8x8x0.9mm) package at NSEB assembly site.
15-Aug-2019
    
CCB 3754 Final Notice: Qualification of MMT as a new assembly site for selected SMSC COM20020I3V device family available in 28L PLCC (11.5x11.5x4.4mm) package.
15-Aug-2019
    
CCB 3861 and 3861.001 Initial Notice: Qualification of ASE as a new assembly site for selected products available in 100L LFBGA (9x9x1.38mm and 10x10x1.42mm) packages.
14-Aug-2019
    
CCB 3837 Initial Notice: Qualification of LMC-705VF mold compound material for Microsemi VSC8248YJH-02 catalog part number (CPN) of 0.13µm TSMC wafer technology available in 225L FCCSP package at SFA1 assembly site.
14-Aug-2019
    
CCB 3871 Initial Notice: Qualification of MMT as an additional assembly site for selected Atmel products of 58.85K wafer technology available in 100L TQFP (14x14x1.0 mm) package.
13-Aug-2019
      
CCB 3755 Final Notice: Qualification of MMT as a new assembly site for selected SMSC COM20019I and COM20020I device families available in 28L PLCC (11.5x11.5x4.4mm) package.
13-Aug-2019
    
ERRATA - USB2412 Errata Document Revision
13-Aug-2019
    
ERRATA - SAMA5D2 System in Package (SiP) Silicon Errata and Data Sheet Clarifications Document Revision
13-Aug-2019
    
ERRATA - KSZ8863 Errata Document Revision
13-Aug-2019
    
ERRATA - KSZ8873 Errata Document Revision
13-Aug-2019
    
CCB 3905 Final Notice: Implement plastic box packing material for selected Microchip die sales products.
13-Aug-2019
    
CCB 3863 Final Notice: Implement Microchip marking changes for selected Microsemi (PoE, PM and SNR) products
13-Aug-2019
      
Data Sheet - megaAVR 0-series Family Data Sheet
09-Aug-2019
    
CCB 3857 Final Notice: Implement Microchip Part Aging Policy, Combination Rules, Recertification, Label and Packing Changes for selected Microsemi (SNR, PM, PoE and CBU) products.
09-Aug-2019
      
ERRATA - SAM L21 Family Silicon Errata and Data Sheet Clarification
08-Aug-2019
    
ERRATA - SAM L22 Family Silicon Errata and Data Sheet Clarification
08-Aug-2019
    
ERRATA - SAM R34/R35 Errata Sheet
08-Aug-2019
    
ERRATA - SAM G53 Series Family Silicon Errata and Data Sheet Clarifications
08-Aug-2019
    
ERRATA - SAM G55 Series Family Silicon Errata and Data Sheet Clarifications
08-Aug-2019
    
ERRATA - SAM D09 Series Family Silicon Errata and Data Sheet Clarifications
08-Aug-2019
    
ERRATA - SAM D10 Series Family Silicon Errata and Data Sheet Clarifications
08-Aug-2019