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Product Change Notifications



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Notification ID
Notification subject
Date Sent
Documents
CCB 3867 Initial Notice: Qualification of ASE as a new assembly site for selected products of 0.15µm TSMC wafer technology available in 100L LFBGA (9x9x1.38 mm) package.
15-Jul-2019
    
CCB 3498 Initial Notice: Qualification of MMT as an additional assembly site for selected Atmel products of 66.11K, 66.15K, 66.26K wafer technology available in 100L TQFP (14x14x1mm) package.
15-Jul-2019
      
ERRATA - SAM E70/S70/V70/V71 Family Errata and Data Sheet Clarification
15-Jul-2019
    
CCB 3834 Initial Notice: Qualification of Global Foundries Fab 3/5 (GF358) as a new fabrication site for selected SMSC products of ECE1117, SCH5553 and SCH5555 device families.
15-Jul-2019
    
CCB 3870 Initial Notice: Qualification of MMT assembly site for selected products of 0.18µm GF wafer technology available in 128L TQFP (14x14x1 mm) package.
15-Jul-2019
    
ERRATA - PIC16(L)F15325/45 Family Silicon Errata and Data Sheet Clarification
11-Jul-2019
    
ERRATA - PIC16(L)F15324/44 Family Silicon Errata and Data Sheet Clarification
11-Jul-2019
    
Data Sheet - MIC2172/3172 - 100kHz 1.25A Switching Regulators Datasheet Document Revision
10-Jul-2019
    
Data Sheet - KSZ9897R - 7-Port Gigabit Ethernet Switch with Two RGMII/MII/RMIII Interfaces Datasheet Document Revision
10-Jul-2019
    
Data Sheet - KSZ9567R Data Sheet Document Revision
10-Jul-2019
    
Data Sheet - KSZ8567R Data Sheet Document Revision
10-Jul-2019
    
Data Sheet - KSZ8565R Data Sheet Document Revision
10-Jul-2019
    
Data Sheet - ATA6565 Dual High-Speed CAN Transceiver with Standby Mode Datasheet Document Revision
10-Jul-2019
    
ERRATA - SAM DA1 Family Silicon Errata and Data Sheet Clarifications
10-Jul-2019
    
CCB 3816 Final Notice: Qualification of ASSH as a new assembly site for selected Micrel products available in 128L PQFP (14x20x2.72mm) package.
10-Jul-2019
    
Data Sheet - HV2801/HV2901 32-Channel Low-Charge-Injection High-Voltage Analog Switches
09-Jul-2019
    
Data Sheet - TP0620 P-Channel Enhancement-Mode Vertical DMOS FET Data Sheet
09-Jul-2019
    
CCB 3740.001 Final Notice: Qualification of MTAI as an additional final test site for selected Microsemi ENT VSC850x and VSC71x device families available in 135L QFN (12x12x0.85 mm) and 32L VQFN (5x5x0.85 mm) packages.
09-Jul-2019
      
CCB 3832 Initial Notice: Qualification of MTAI as a new final test site for selected products of the 0.25 um wafer technology available in 32L PDIP (0.600 in) package.
09-Jul-2019
      
CCB 3843 Final Notice: Implement Microchip Packing Changes for selected Microsemi (LCLD, VPT, TIM, WIFI) products.
07-Jul-2019
    
CCB 3454 and 3454.001 Final Notice: Qualification of GTBF as a new assembly site for selected products of 0.8um XFAB, 0.8um AMS and 0.6um AMI, 130K and 133K wafer technologies available in 3L and 5L DDPAK packages with MSL 3 classification.
05-Jul-2019
    
CCB 1737.10 Final Notice: Release to production of listed Micrel Regulator product type manufactured with the CSI05 process technology to Microchip Fab.
05-Jul-2019
        
CCB 1737.04 Final Notice: Release to production of listed Micrel Regulator product type manufactured with the BCDM process technology to Microchip Fab.
05-Jul-2019
        
ERRATA - megaAVR 0-series Silicon Errata and Data Sheet Clarifications
05-Jul-2019
    
Data Sheet - ATtiny202/402 Data Sheet
05-Jul-2019