See attachments of affected catalog part numbers
(CPN) labeled as…
Qualification of palladium
coated copper (PdCu) bond wire in selected products of the 200K wafer
technology available in 14L, 18L and 20L PDIP and 28L SPDIP package at MMT
NOTE: Selected products
are non-automotive devices. Please review the affected CPN lists (attached) to
identify the actual parts affected.
Gold (Au) bond wire
coated copper (PdCu) bond wire
to Data Sheet:
manufacturability and qualify PdCu bond wire at MMT assembly site.
First Ship Date:
July 11, 2015 (date code: 1528)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
07, 2015: Issued initial
22, 2015: Issued final
notification. Attached the qualification report. Revised the estimated first
ship date from June 20, 2015 to July 11, 2015.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.