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Product Change Notification - JAON-29UXDQ760   (Convert To PDF)


Date:
06 Jun 2016
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Touch Sensing Technologies; 8-bit Microcontrollers; 32-bit PIC Microcontrollers
Notification subject:
CCB 1751 and 1751.01 Cancellation Notice: For the qualification of CuPdAu bond wire in selected products of the 0.18um TSMC CUP wafer technology available in 64L and 44L TQFP (10x10mm) package at MTAI
Notification text:

PCN Status: 
Cancellation notification

Microchip Parts Affected:
This change would have affected selected products of the 0.18um TSMC CUP wafer technology available in 64L and 44L TQFP (10x10mm) package at MTAI assembly site.

Description of Change:
This qualification was originally performed to qualify palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18um TSMC CUP wafer technology available in 64L and 44L TQFP (10x10mm) package at MTAI assembly site.

Impacts to Data Sheet: 
Not Applicable

Reason for Change:
Microchip has decided not to qualify palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18um TSMC CUP wafer technology available in 64L and 44L TQFP (10x10mm) package at MTAI assembly site.

Change Implementation Status:
Not Applicable

Estimated First Ship Date:
Not Applicable

Markings to Distinguish Revised from Unrevised Devices:  
Not Applicable

Revision History:
October 14, 2015:
 Issued initial notification.
January 21, 2016: Revised the estimated first ship date from November 30, 2015 to April 20, 2016.
June 6, 2016: Issued cancellation notice for the proposed qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18um TSMC CUP wafer technology available in 64L and 44L TQFP (10x10mm) package at MTAI assembly site.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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