See attachments of affected catalog part
numbers (CPN) labeled as…
Qualification of palladium coated copper (PdCu) bond
wire for selected products of 150K and 160K wafer technologies in 8L SOIC
package at MMT assembly site.
Gold (Au) bond wire.
Palladium coated Copper (PdCu) bond wire or Gold (Au)
Impacts to Data
To improve manufacturability
and qualify PdCu bond wire at MMT assembly site.
February 16, 2015 (date code: 1508)
NOTE: Please be advised that after the
estimated first ship date customers may receive pre and post change parts.
Distinguish Revised from Unrevised Devices:
August 18, 2014: Issued initial notification.
January 29, 2015: Issued final notification.
Attached the qualification report. Revised the estimated first ship date from
November 10, 2014 to February 16, 2015.
The change described in this PCN does not alter
Microchip’s current regulatory compliance regarding the material content of the