Microchip Parts Affected:
See attachments of affected catalog part
numbers (CPN) labeled as…
Qualification of palladium coated copper (PdCu) bond
wire in selected products of the 90K, 120K, and 121K technologies available in
8L SOIC package at MMT assembly site.
Impacts to Data
To improve manufacturability by
qualifying PdCu wire at MMT assembly site.
February 16, 2015 (date code: 1508)
NOTE: Please be advised that after the
estimated first ship date customers may receive pre and post change parts.
Distinguish Revised from Unrevised Devices:
August 18, 2014: Issued initial notification.
January 12, 2015: Issued final notification.
Attached the qualification report. Revised the estimated first ship date from
November 10, 2014 to February 16, 2015.
The change described in this PCN does not alter
Microchip’s current regulatory compliance regarding the material content of the