Please open the attachments found in the
attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip
includes identical files in two formats (.pdf and .xls).
Qualification of palladium coated copper with gold
flash (CuPdAu) bond wire and G700HA molding compound in selected products of
the 90nm TSMC wafer technology available in 100L (12 x 12mm) and 64L (10 x
10mm) TQFP package at MTAI assembly site.
Gold wire (Au) bond
and SG-8300ECM molding compound
Palladium coated copper
with gold flash (CuPdAu) bond wire and G700HA molding compound
to Data Sheet:
To improve on-time delivery performance by
qualifying Palladium coated copper with gold flash (CuPdAu) bond wire and
G700HA molding compound.
First Ship Date:
October 30, 2015 (date code: 1544)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
21, 2015: Issued initial
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.