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Product Change Notification - JAON-25KYQT864   (Convert To PDF)


Date:
05 Dec 2014
Product Category:
Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers; RF and Security
Notification subject:
CCB 1381.01 Final Notice: Qualification of palladium coated copper (PdCu) bond wire in selected products of 90K, 120K and 121K wafer technologies available in 14L and 8L TSSOP package at MMT assembly
Notification text:

PCN Status:
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-25KYQT864_Affected_CPN.xls
PCN_JAON-25KYQT864_Affected_CPN.pdf

Description of Change:
Qualification of palladium coated copper (PdCu) bond wire in selected products of 90K, 120K and 121K wafer technologies available in 14L and 8L TSSOP package at MMT assembly site.

NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.

Pre Change:
Au bond wire

Post Change:
PdCu bond wire

Impacts to Data Sheet:
None

Reason for Change:
To improve manufacturability and qualify PdCu wire at MMT assembly site.  

Change Implementation Status:
In Progress

Estimated First Ship Date:
December 15, 2014 (date code: 1451)

NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:
Traceability code

Revision History:
September 8, 2014: Issued initial notification.
December 5, 2014: Issued final notification. Attached the Qualification Report. Revised the estimated first ship date from October 30, 2014 to December 15, 2014.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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