See attachments of affected catalog part
numbers (CPN) labeled as…
Qualification of palladium coated copper
(PdCu) bond wire in selected products of 90K, 120K and 121K wafer technologies
available in 14L and 8L TSSOP package at MMT assembly site.
NOTE: Selected products are non-automotive standalone
analog and PIC MCU devices. Please review the affected CPN lists (attached) to
identify the actual parts affected.
Au bond wire
PdCu bond wire
Impacts to Data
To improve manufacturability
and qualify PdCu wire at MMT assembly site.
December 15, 2014 (date code: 1451)
NOTE: Please be advised that after the
estimated first ship date customers may receive pre and post change parts.
Distinguish Revised from Unrevised Devices:
September 8, 2014: Issued initial notification.
December 5, 2014: Issued final notification.
Attached the Qualification Report. Revised the estimated first ship date from
October 30, 2014 to December 15, 2014.
The change described in this PCN does not alter
Microchip’s current regulatory compliance regarding the material content of the