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Product Change Notification - JAON-22LAXV706   (Convert To PDF)


Date:
13 Oct 2015
Product Category:
Memory; Analog (Linear & Mixed Signal) AND Interface; Radio Frequency Devices; 8-bit Microcontrollers
Notification subject:
CCB 1656 and 1656.01 Final Notice: Qualification of CuPdAu bond wire in selected products of the 120K and 121K wafer technologies available in 8L SOIC package at MMT assembly site.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.

NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).

Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 120K and 121K wafer technologies available in 8L SOIC package at MMT assembly site.

Pre Change: 
Palladium coated copper wire (PdCu)

Post Change:
Palladium coated copper wire with gold flash (CuPdAu)

Impacts to Data Sheet: 
None 

Reason for Change:
To improve manufacturability and qualify palladium coated copper with gold flash (CuPdAu) bond wire.

Change Implementation Status:
In Progress

Estimated First Ship Date:
November 09, 2015 (date code: 1546)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:  
Traceability code

Revision History:
June 29, 2015: Issued initial notification.
October 13, 2015: Issued final notification. Attached the qualification report. Revised the estimated first ship date from October 20, 2015 to November 9, 2015.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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