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Product Change Notification - JAON-20BQVK768   (Convert To PDF)

04 May 2017
Product Category:
Power Management - Power Switches; Power Management - PWM Controllers; Switching Regulators; Power MOSFET Drivers; Linear Regulators
Notification subject:
CCB 2837 Intermediate Notice: Qualification of Fabrication site (FAB 5) for Micrel products manufactured with the BCD05 process technology.
Notification text:

PCN Status: 
Intermediate notification

Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.

NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).

Description of Change:
Qualification of Fabrication site (FAB 5) for Micrel products manufactured with the BCD05 process technology. This PCN is to inform you that qualification of the BCD05 process technology has completed and to provide the report for your review. Although we are providing you with the qualification data, products in this process technology will not ship from Fabrication site (FAB 5) until after the final PCN has been issued.

Please review the FAQ attached on this notification for additional information about this change. 

Pre Change:
Fabricated at Micrel fabrication site (San Jose, CA, USA) (SJ) using 6 inch wafers.

Post Change:
Fabricated at Atmel Fabrication site FAB 5 (Colorado Springs, CO, USA) (COS) using 6 inch wafers

Note: Microchip previously announced that the qualification of this process technology (BCD05) will be qualified at Microchip Fabrication Sites using 8 inch wafers. That qualification will proceed and will be communicated when completed as indicated in PCN CYER-31JLEX86. The Colorado Springs location will become the primary location and the only site that will ship products in this process technology (BCD05) while the Microchip Fabrication sites using 8 inch wafers will be backup fab sites, which can be used if there is some sort of critical issue.

Pre and Post Change Summary:


Pre Change

Post Change

Fabrication Location

Micrel Fabrication Site (San Jose, CA, USA)

Primary Fab Location:
Atmel Fabrication site FAB 5 (Colorado Springs, CO USA)

Backup Fab Locations:
Microchip Fabrication Sites (Tempe, AZ and Gresham, OR, USA)

Wafer Diameter

6 inches (150 mm)

6 inches (150 mm)

8 inches (200 mm)

Quality certification




Data sheet / specifications

No Change

No Change

No Change


No Change

No Change

No Change

Die Size

No change

No change

No change

Final test program

No change

No change

No change

Package Type/MSL

No Change

No Change

No Change

Impacts to Data Sheet: 
No impact anticipated.

Change Impact:

Reason for Change:
To improve productivity with the closure of the Micrel fab (SJ) as part of the integration of Micrel and Microchip.

Change Implementation Status:
In Progress

Estimated First Ship Date:
Catalog part numbers fabricated at FAB 5 will not ship until after the final PCN has been issued with the listed CPN(s) attached. Microchip will issue Final PCNs as mask sets are released to production at FAB 5.

NOTE:  This FAB transition will vary by catalog part number (CPN) and may take several months/years to complete the transition that may result in several final PCNs.

Summary Time Table of notable events to date: 


December 2016


May 2017

May 2017 onwards











Initial PCN Issue Date












Qualification Report Availability and Intermediate PCN issue date











Final PCN Issue Date










Will be issued as catalog part numbers (CPNs) are released to production

Method to Identify Change:  
Traceability code. 

Qualification Report:
Please open the attachments included with this PCN labeled as PCN_#_Qual Report.

Revision History:
December 23, 2016: Issued initial notification.
May 4, 2017: Issued intermediate notification. Attached the Qualification Report.

The change described in this PCN does not alter Micrel’s or Atmel’s or Microchip’s current regulatory compliance regarding the material content of the applicable products. 

Please contact your local Microchip sales office with questions or concerns regarding this notification.

Terms and Conditions:

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