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Product Change Notification - JAON-18SYIF727   (Convert To PDF)


Date:
08 Apr 2015
Product Category:
8-bit Microcontrollers; 16-bit Microcontrollers and Digital Signal Controllers
Notification subject:
CCB 1533 Final Notice: Qualification of palladium coated copper with gold flash (PdCuAu) bond wire in selected products of the 200K wafer technology available in 44L, 64L and 80L TQFP package at MTAI
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-18SYIF727_Affected_CPN.xls
PCN_JAON-18SYIF727_Affected_CPN.pdf

Description of Change:
Qualification of palladium coated copper with gold flash (PdCuAu) bond wire in selected products of the 200K wafer technology available in 44L, 64L and 80L TQFP package at MTAI assembly site.

Pre Change:
Gold (Au) or Palladium coated copper (PdCu) bond wire

Post Change:
Palladium coated copper with gold flash (PdCuAu) or Palladium coated copper (PdCu) or Gold (Au) bond wire

Impacts to Data Sheet: 
None 

Reason for Change:
To improve manufacturability and qualify PdCuAu bond wire at MTAI assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
May 18, 2015 (date code: 1521)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:   
Traceability code

Revision History:
March 31, 2015: Issued initial notification.
April 08, 2015: Issued final notification. Attached the qualification report.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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