See attachments of affected catalog part numbers
(CPN) labeled as…
Qualification of palladium
coated copper with gold flash (PdCuAu) bond wire in selected products of the
200K wafer technology available in 44L, 64L and 80L TQFP package at MTAI
Gold (Au) or Palladium
coated copper (PdCu) bond wire
coated copper with gold flash (PdCuAu) or Palladium coated copper (PdCu) or Gold (Au) bond wire
to Data Sheet:
manufacturability and qualify PdCuAu bond wire at MTAI assembly site.
First Ship Date:
May 18, 2015 (date code: 1521)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
31, 2015: Issued initial
08, 2015: Issued final
notification. Attached the qualification report.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.