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Product Change Notification - JAON-18OBAP766   (Convert To PDF)


Date:
14 Mar 2016
Product Category:
8-bit Microcontrollers
Notification subject:
CCB 1554 Cancellation Notice: For the qualification of palladium coated copper (PdCu) bond wire in selected products of the 90K and 120K wafer technology available in 44L MQFP package at ANAP site.
Notification text:

PCN Status: 
Cancellation notification

Microchip Parts Affected:
This change would have affected selected products of the 90K and 120K wafer technology available in 44L MQFP package at ANAP assembly site.

Description of Change:
This qualification was originally performed to qualify palladium coated copper (PdCu) bond wire in selected products of the 90K and 120K wafer technology available in 44L MQFP package at ANAP.

Impacts to Data Sheet: 
Not Applicable

Reason for Change (Cancellation):
Microchip has decided not to qualify of palladium coated copper (PdCu) bond wire in selected products of the 90K and 120K wafer technology available in 44L MQFP package at ANAP assembly site.

Change Implementation Status:
Not Applicable

Estimated First Ship Date:
Not Applicable

Markings to Distinguish Revised from Unrevised Devices:   
Not Applicable

Revision History:
April 07, 2015: Issued initial notification.
March 14, 2016: Issued cancellation notice for the proposed qualification of palladium coated copper (PdCu) bond wire in selected products of the 90K and 120K wafer technology available in 44L MQFP package at ANAP assembly site.




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