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Product Change Notification - JAON-16UWYU638   (Convert To PDF)


Date:
27 Nov 2015
Product Category:
Analog (Thermal, Power Management & Safety)
Notification subject:
CCB 1747 Final Notice: Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MTAI assembly site.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.

NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).

Description of Change:
Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MTAI assembly site.

Pre Change: 
Using conductive die attach epoxy 8390A.

Post Change:
Using non-conductive die attach epoxy 8900NC. 

Pre and Post Change Summary:

 

Pre Change

Post Change

Assembly Site

MTAI assembly site

MTAI assembly site

Wire material

Au wire

Au wire

Die attach material

8390A

(conductive die attach epoxy)

8900NC

(non-conductive die attach epoxy)

Molding compound material

SG-8300GM or G600IMP10 or G600V      

G600IMP10 or G600V      

Lead frame material

C194

C194

Impacts to Data Sheet: 
None 

Reason for Change:
To improve manufacturability by qualifying non-conductive die attach epoxy 8900NC at MTAI assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
December 27, 2015 (date code: 1552)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Summary Table:

 

September 2015

October 2015

November 2015

December 2015

WW

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

Initial PCN Issue Date

 

 

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Qual Report Availability

 

 

 

 

 

 

 

 

X

 

 

 

 

 

 

 

 

 

Final PCN Issue Date

 

 

 

 

 

 

 

 

 

 

 

 

X

 

 

 

 

 

Implementation Date

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X

 

Markings to Distinguish Revised from Unrevised Devices:  
Traceability code

Revision History:
September 21, 2015: Issued initial notification.
November 27, 2015: Issued final notification. Attached the qualification report. Revised the estimated first ship date from November 30, 2015 to December 27, 2015.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

Terms and Conditions:

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