See attachments of affected catalog part
numbers (CPN) labeled as…
Qualification of palladium
coated copper (PdCu) bond wire
and 3280 die attach epoxy in selected products of the
150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly
NOTE: Selected products are non-automotive devices.
Please review the affected CPN lists (attached) to identify the actual parts
Gold wire and 8390A die
PdCu wire and 3280 die attach epoxy
to Data Sheet:
To improve manufacturability
and qualify PdCu bond wire at MTAI assembly site.
First Ship Date:
April 24, 2015 (date code: 1517)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
18, 2015: Issued initial
07, 2015: Issued final
notification. Attached the qualification report. Revised the estimated first
ship date from May 27, 2015 to April 24, 2015.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.