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Product Change Notification - JAON-16HTIO720   (Convert To PDF)


Date:
07 Apr 2015
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers
Notification subject:
CCB 1155.39 Final Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-16HTIO720_Affected_CPN.xls
PCN_JAON-16HTIO720_Affected_CPN.pdf

Description of Change:
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.

NOTE: Selected products are non-automotive devices. Please review the affected CPN lists (attached) to identify the actual parts affected.

Pre Change:
Gold wire and 8390A die attach epoxy

Post Change:
PdCu wire and 3280 die attach epoxy

Impacts to Data Sheet: 
None 

Reason for Change:
To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
April 24, 2015 (date code: 1517)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:  
Traceability code

Revision History:
February 18, 2015: Issued initial notification.
April 07, 2015: Issued final notification. Attached the qualification report. Revised the estimated first ship date from May 27, 2015 to April 24, 2015.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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