Please open the attachments found in the
attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip
includes identical files in two formats (.pdf and .xls).
Qualification of palladium coated copper (PdCu) bond
wire in selected products of the 40K, 42K, 57K, 77K (SLM) and 77K (DLM) wafer
technologies available in 28L SPDIP and
8L, 14L and 18L PDIP package at MMT assembly site.
Gold (Au) bond wire
Palladium coated copper
(PdCu) bond wire
to Data Sheet:
To improve manufacturability by qualifying palladium
coated copper (PdCu) bond wire at
MMT assembly site.
First Ship Date:
October 30, 2015 (date code: 1544)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
21, 2015: Issued final
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.