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Product Change Notification - JAON-15ERIE320   (Convert To PDF)


Date:
30 Sep 2015
Product Category:
Notification subject:
CCB 1744 Final Notice: Qualification of PdCu bond wire in selected products of the 40K, 42K, 57K, 77K (SLM) and 77K (DLM) wafer technologies in 28L SPDIP and 8L, 14L and 18L PDIP package at MMT site.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.

NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).

Description of Change:
Qualification of palladium coated copper (PdCu) bond wire in selected products of the 40K, 42K, 57K, 77K (SLM) and 77K (DLM) wafer technologies available in 28L SPDIP and  8L, 14L and 18L PDIP package at MMT assembly site.

Pre Change: 
Gold (Au) bond wire

Post Change:
Palladium coated copper (PdCu) bond wire

Impacts to Data Sheet: 
None 

Reason for Change:
To improve manufacturability by qualifying palladium coated copper (PdCu) bond wire at MMT assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
October 30, 2015 (date code: 1544)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:  
Traceability code

Revision History:
September 21, 2015: Issued final notification.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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