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Product Change Notification - JAON-09TVHB927   (Convert To PDF)


Date:
06 Oct 2016
Product Category:
32-bit PIC Microcontrollers
Notification subject:
CCB 1460 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 144L TQFP package at ANAP assembly site.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.

NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).

Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 144L TQFP package at ANAP assembly site.

Pre Change: 
Using Gold (Au) bond wire

Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire

Pre and Post Change Summary:

 

Pre Change

Post Change

Assembly Site

ANAP assembly site

ANAP assembly site

Wire material

Au wire

CuPdAu wire

Die attach material

3230

3230

Molding compound material

G700L

G700L

Lead frame material

C194

C194

Impacts to Data Sheet: 
None 

Change Impact:
None

Reason for Change:
To improve manufacturability and qualify CuPdAu wire at ANAP assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
November 25, 2016 (date code: 1647)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Time Table Summary:

 

October 2014

->

July 2015

->

October 2016

November 2016

Workweek

22

23

24

25

26

 

27

28

29

30

31

 

40

41

42

43

44

45

46

47

Initial PCN Issue Date

 

X

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Initial PCN revision Issue Date

 

 

 

 

 

 

 

 

 

 

X

 

 

 

 

 

 

 

 

 

Qual Report Availability

 

 

 

 

 

 

 

 

 

 

 

 

X

 

 

 

 

 

 

 

Final PCN Issue Date

 

 

 

 

 

 

 

 

 

 

 

 

X

 

 

 

 

 

 

 

Estimated Implementation Date

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

X

Method to Identify Change:  
Traceability code

Qualification Report:
Please open the attachments included with this PCN labeled as PCN_#_Qual Report.

Revision History:
October 15, 2014: Issued initial notification.
July 29, 2015: Changed the bonding wire from palladium coated copper (PdCu) to palladium coated copper with gold flash (CuPdAu) bond wire. Revised the estimated first ship date from May 1, 2015 to January 15, 2016.
October 6, 2016: Issued final notification. Attached the qualification report. Revised the estimated first ship date from January 15, 2016 to November 25, 2016. Updated the affected parts list. Updated PCN letter to add the pre and post change summary table and the time table summary.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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