See attachments of affected catalog part numbers
(CPN) labeled as…
Qualification of palladium
coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products
of the 200K wafer technology available in 28L SSOP package at MTAI assembly
NOTE: Selected products are non-automotive devices. Please
review the affected CPN lists (attached) to identify the actual parts affected.
Gold wire and 8390A die
PdCu wire and 3280 die attach epoxy
to Data Sheet:
To improve manufacturability
and qualify PdCu bond wire at MTAI assembly site.
First Ship Date:
January 23, 2015 (date code: 1504)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
17, 2014: Issued initial
8, 2015: Issued final
notification. Attached the qualification report.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.