See attachments of affected catalog part numbers
(CPN) labeled as…
Qualification of palladium
coated copper (PdCu) bond wire in selected products of the 90K, 120K, 121K, 150K,
160K, 200K, and 0.25um wafer technologies available in 20L SSOP package at MTAI
NOTE: Selected products are non-automotive devices.
Please review the affected CPN lists (attached) to identify the actual parts
to Data Sheet:
To improve manufacturability
and qualify PdCu bond wire at MTAI assembly site.
First Ship Date:
January 9, 2015 (date code: 1502)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
20, 2014: Issued initial
22, 2014: Issued final
notification. Attached the qualification report. Revised the estimated first
ship date from December 19, 2014 to January 9, 2015.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.