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Product Change Notification - JAON-04PRHD989   (Convert To PDF)


Date:
22 Jun 2015
Product Category:
Analog (Linear & Mixed Signal) AND Interface; 16-bit Microcontrollers and Digital Signal Controllers; 8-bit Microcontrollers
Notification subject:
CCB 1619 Final Notice: Qualification of MMT assembly site for selected products in 40L PDIP package using gold (Au) bond wire.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-04PRHD989_Affected_CPN.xls
PCN_JAON-04PRHD989_Affected_CPN.pdf

Description of Change:
Qualification of MMT assembly site for selected products in 40L PDIP package using gold (Au) bond wire.

Pre Change: 
MTAI assembly site.

Post Change:
MMT assembly site

Impacts to Data Sheet: 
None 

Reason for Change:
To improve manufacturability by qualifying MMT assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
June 22, 2015 (date code: 1526)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:  
Traceability code

Revision History:
May 13, 2015: Issued initial notification.
June 22, 2015: Issued final notification. Attached the qualification report. Revised the estimated first ship date from June 15, 2015 to June 22, 2015.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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