See attachments of affected catalog part
numbers (CPN) labeled as…
Qualification of G700LTD
molding compound and 8600 die attach epoxy for 8L DFN (2x3x0.9mm), 8L DFN
(3x3x0.9mm), 8L DFN (4x4x0.9mm), 10L DFN (3x3x0.9mm), 8L UDFN (2x3x0.5mm), 8L UDFN
(3x3x0.5mm) and 8L DFN-S (6x5x0.9mm)
packages at NSEB assembly site.
G770HCD molding compound
and 8200T die
molding compound and 8600 die attach epoxy
to Data Sheet:
To improve manufacturability by qualifying molding compound and die
First Ship Date:
February 28, 2015 (date code: 1509)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
18, 2015: Issued final
20, 2015: Revised PCN to remove some devices that will not be
affected by this change. Revised the attached affected parts list.
The change described in this PCN does not alter Microchip’s current
regulatory compliance regarding the material content of the applicable products.