See attachments of affected catalog part
numbers (CPN) labeled as…
Qualification of MMT assembly site for selected
products in 40L PDIP package using palladium coated copper (PdCu) bond wire.
MTAI assembly site.
MMT assembly site
to Data Sheet:
To improve manufacturability
by qualifying MMT assembly site.
First Ship Date:
July 15, 2015 (date code: 1529)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
13, 2015: Issued initial
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.