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Product Change Notification - JAON-04CYDE005   (Convert To PDF)


Date:
13 May 2015
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; 8-bit Microcontrollers
Notification subject:
CCB 1620 Initial Notice: Qualification of MMT assembly site for selected products in 40L PDIP package using palladium coated copper (PdCu) bond wire.
Notification text:

PCN Status: 
Initial notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-04CYDE005_Affected_CPN.xls
PCN_JAON-04CYDE005_Affected_CPN.pdf

Description of Change:
Qualification of MMT assembly site for selected products in 40L PDIP package using palladium coated copper (PdCu) bond wire.

Pre Change: 
MTAI assembly site.

Post Change:
MMT assembly site

Impacts to Data Sheet: 
None 

Reason for Change:
To improve manufacturability by qualifying MMT assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
July 15, 2015 (date code: 1529)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:  
Traceability code

Revision History:
May 13, 2015: Issued initial notification.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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