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Product Change Notification - JAON-01XOEE717   (Convert To PDF)


Date:
01 Jun 2015
Product Category:
Memory; Analog (Linear & Mixed Signal) AND Interface
Notification subject:
CCB 1563 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L SOIC package at MTAI assembly site.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-01XOEE717_Affected_CPN.xls
PCN_JAON-01XOEE717_Affected_CPN.pdf

Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L SOIC package at MTAI assembly site.

NOTE: Selected products are non-automotive devices. Please review the affected CPN lists (attached) to identify the actual parts affected.

Pre Change:
Gold (Au) bond wire

Post Change:
Palladium coated copper with gold flash (CuPdAu) bond wire

Impacts to Data Sheet: 
None 

Reason for Change:
To improve manufacturability and qualify CuPdAu bond wire at MTAI assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
June 26, 2015 (date code: 1526)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:   
Traceability code

Revision History:
April 08, 2015: Issued initial notification.
June 01, 2015: Issued final notification. Attached the qualification report.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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