See attachments of affected catalog part numbers
(CPN) labeled as…
Qualification of palladium
coated copper with gold flash (CuPdAu) bond wire in selected products of the
160K wafer technology available in 8L SOIC package at MTAI assembly site.
NOTE: Selected products are
non-automotive devices. Please review the affected CPN lists (attached) to
identify the actual parts affected.
Gold (Au) bond wire
coated copper with gold flash (CuPdAu) bond wire
to Data Sheet:
To improve manufacturability
and qualify CuPdAu bond wire at MTAI assembly site.
First Ship Date:
June 26, 2015 (date code: 1526)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
08, 2015: Issued initial
June 01, 2015: Issued final
notification. Attached the qualification report.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.