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Product Change Notification - JAON-01QMAQ209   (Convert To PDF)


Date:
24 Aug 2015
Product Category:
Memory; RF and Security; Supertex; Analog (Thermal, Power Management & Safety); Analog (Linear & Mixed Signal) AND Interface; Radio Frequency Devices; Touch Sensing Technologies; 8-bit Microcontrollers
Notification subject:
CCB 1566 Final Notice: Qualification of LPI assembly site as an additional site for selected products in 8L SOIC package.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-01QMAQ209_Affected_CPN.xls
PCN_JAON-01QMAQ209_Affected_CPN.pdf

Description of Change:
Qualification of LPI assembly site as an additional site for selected products in 8L SOIC package.

NOTE: Selected products are non-automotive devices. Please review the affected CPN lists (attached) to identify the actual parts affected.

Pre Change:
MTAI or MMT or ATES assembly site

Post Change:
MTAI or MMT or ATES or LPI assembly site

Impacts to Data Sheet: 
None 

Reason for Change:
To improve on-time delivery performance by qualifying LPI as an additional assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
September 4, 2015 (date code: 1536)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:   
Traceability code

Revision History:
April 08, 2015: Issued initial notification.
August 24, 2015: Issued final notification. Attached the qualification report. Revised the estimated first ship date from May 15, 2015 to September 4, 2015.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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