Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of palladium coated copper (PdCu) bond wire for selected 0.18um products in 64L & 44L TQFP packages at MTAI assembly site.
NOTE: Selected products are non-automotive for standalone PIC MCU products. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
May 9, 2014 (Date code: 1419)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
February 11, 2014: Issued initial notification using the Notification ID IIRA-31RUVX125.
May 8, 2014: Issued final notification using the Notification ID IIRA-30XLTU681. Removed the 200K process technology from the final notification subject, description and list of Affected CPN. Attached the qualification report. Revised the estimated first ship date from March 28, 2014 to May 9, 2014.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.