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Product Change Notification - IIRA-08SZRJ543   (Convert To PDF)


Date:
18 Aug 2014
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; 8-bit Microcontrollers; 32-bit PIC Microcontrollers
Notification subject:
CCB 1360.02 Initial Notice: Qualification of 100L TQFP (14x14x1mm) package with palladium coated copper (PdCu) bond wire at ASE assembly site.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_IIRA-08SZRJ543_Affected_CPN.xls
PCN_IIRA-08SZRJ543_Affected_CPN.pdf

Description of Change:
Qualification of 100L TQFP (14x14x1mm) package with palladium coated copper (PdCu) bond wire at ASE assembly site.

Impacts to Data Sheet: 
None

Reason for Change:
To improve productivity  

Change Implementation Status:
In Progress

Estimated First Ship Date:
August 31, 2014 (date code: 1435)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:   
Traceability code

Revision History:
January 15, 2014: Issued initial notification.
August 18, 2014: Issued final notification.  Attached the qualification report. Revised the estimated first ship date from May 2, 2014 to August 31, 2014.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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