See attachments of affected catalog part numbers
(CPN) labeled as…
Qualification of 100L
TQFP (14x14x1mm) package with palladium coated copper (PdCu) bond wire at ASE
to Data Sheet:
First Ship Date:
August 31, 2014 (date code: 1435)
NOTE: Please be advised that after the estimated
first ship date customers may receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
15, 2014: Issued initial
18, 2014: Issued final
notification. Attached the qualification report. Revised the estimated
first ship date from May 2, 2014 to August 31, 2014.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.