See attachments of affected catalog part numbers
(CPN) labeled as…
Qualification of 100L
TQFP (14x14x1mm) package with gold (Au) wire for selected 0.18um TSMC wafer
technology products at ASE assembly site.
Assembled at ANAP using lead frame Eftek64T material, 3230
die attach epoxy and G700L molding compound.
at ASE using lead frame CDA7025 material, CRM-1076WA die attach epoxy and G631H
molding compound. This package, 100L TQFP (14x14x1mm), will still be assembled at
ANAP using the BOM stated on the pre-change.
to Data Sheet:
First Ship Date:
July 24, 2014 (date code: 1430)
NOTE: Please be advised that after the estimated
first ship date customers may receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
15, 2014: Issued initial
21, 2014: Issued final
notification. Attached the qualification report. Revised the estimated
first ship date from May 18, 2014 to July 24, 2014.
28, 2014: Revised the
subject to only include the qualification of 0.18um TSMC wafer technology.
Updated affected CPN list to only include 0.18um TSMC wafer technology
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.