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Product Change Notification - IIRA-08MVZQ035   (Convert To PDF)

28 Aug 2014
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; 8-bit Microcontrollers; 32-bit PIC Microcontrollers
Notification subject:
CCB 1360.01 Final Notice: Qualification of 100L TQFP (14x14x1mm) package with gold (Au) wire for selected 0.18um TSMC wafer technology products at ASE assembly site
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…

Description of Change:
Qualification of 100L TQFP (14x14x1mm) package with gold (Au) wire for selected 0.18um TSMC wafer technology products at ASE assembly site.

Pre Change:
Assembled at ANAP using lead frame Eftek64T material, 3230 die attach epoxy and G700L molding compound.

Post Change:
Assembled at ASE using lead frame CDA7025 material, CRM-1076WA die attach epoxy and G631H molding compound. This package, 100L TQFP (14x14x1mm), will still be assembled at ANAP using the BOM stated on the pre-change.

Impacts to Data Sheet: 

Reason for Change:
To improve productivity  

Change Implementation Status:

Estimated First Ship Date:
July 24, 2014 (date code: 1430)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:   
Traceability code

Revision History:
January 15, 2014: Issued initial notification.
July 21, 2014: Issued final notification.  Attached the qualification report. Revised the estimated first ship date from May 18, 2014 to July 24, 2014.
August 28, 2014: Revised the subject to only include the qualification of 0.18um TSMC wafer technology. Updated affected CPN list to only include 0.18um TSMC wafer technology products.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.

Please contact your local Microchip sales office with questions or concerns regarding this notification.

Terms and Conditions:

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