See attachments of affected catalog part numbers
(CPN) labeled as…
Qualification of 8600
die attach and G700LTD mold compound for 8L DFN-S (6x5x0.9mm) and 8L DFN
(3x3x0.9mm) packages at NSEB (UTL) assembly site.
to Data Sheet:
To improve on-time delivery performance by qualifying additional mold
compound and die attach materials.
First Ship Date:
November 3, 2014 (date code: 1445)
NOTE: Please be advised that after the estimated
first ship date customers may receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
21, 2014: Issued initial
7, 2014: Issued final
notification. Attached the Qualification Report. Revised the estimated first
ship date from August 17, 2014 to November 3, 2014.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.