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Product Change Notification - IIRA-08LIDK202   (Convert To PDF)


Date:
07 Oct 2014
Product Category:
Analog (Thermal, Power Management & Safety); Analog (Linear & Mixed Signal) AND Interface; Touch Sensing Technologies; 8-bit Microcontrollers; Memory
Notification subject:
CCB 1336.02 Final Notice: Qualification of 8600 die attach and G700LTD mold compound for 8L DFN-S (6x5x0.9mm) and 8L DFN (3x3x0.9mm) packages at NSEB (UTL) assembly site.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_IIRA-08LIDK202_Affected_CPN.xls
PCN_IIRA-08LIDK202_Affected_CPN.pdf

Description of Change:
Qualification of 8600 die attach and G700LTD mold compound for 8L DFN-S (6x5x0.9mm) and 8L DFN (3x3x0.9mm) packages at NSEB (UTL) assembly site.

Impacts to Data Sheet: 
None

Reason for Change:
To improve on-time delivery performance by qualifying additional mold compound and die attach materials.

Change Implementation Status:
Complete

Estimated First Ship Date:
November 3, 2014 (date code: 1445)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:   
Traceability code

Revision History:
May 21, 2014: Issued initial notification.
October 7, 2014: Issued final notification. Attached the Qualification Report. Revised the estimated first ship date from August 17, 2014 to November 3, 2014.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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