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Product Change Notification - GBNG-19QBLM609   (Convert To PDF)


Date:
20 Aug 2019
Product Category:
16-Bit - Microcontrollers and Digital Signal Controllers
Affected CPNs:
  
Notification subject:
CCB 3773 Final Notice: Qualification of MTAI as an additional assembly site for selected products of the 90nm TSMC wafer technology available in 48L TQFP (7x7x1mm) package using gold (Au) bond wire.
Notification text:


PCN Status:  
Final notification

PCN Type:  
Manufacturing Change

Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.

NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).

Description of Change: 
Qualification of MTAI as an additional assembly site for selected products of the 90nm TSMC wafer technology available in 48L TQFP (7x7x1mm) package using gold (Au) bond wire.

Pre Change:
Assembled at ANAP assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, 3230 die attach, G631HQ molding compound and C194 lead frame material.

Post Change:
Assembled at ANAP assembly site using palladium coated copper with gold flash (CuPdAu) bond wire, 3230 die attach, G631HQ molding compound and C194 lead frame material or assembled at MTAI assembly site using gold (Au) bond wire, 3280 die attach, G700HA molding compound and C7025 lead frame material.

Pre and Post Change Summary:

Pre Change

Post Change

Assembly Site

Amkor Technology Philippine (P1/P2), INC. (ANAP)

Amkor Technology Philippine (P1/P2), INC. (ANAP)

Microchip Technology Thailand
(HQ) / MTAI

Wire material

CuPdAu

CuPdAu

Au

Die attach material

3230

3230

3280

Molding compound material

G631HQ

G631HQ

G700HA

Lead frame material

C194

C194

C7025

Impacts to Data Sheet: 
None

Change Impact:
None

Reason for Change:
To improve manufacturability by qualifying MTAI as an additional assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
September 20, 2019 (date code: 1938)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Time Table Summary:

August 2019

September 2019

Workweek

31

32

33

34

35

36

37

38

39

Qual Report Availability

X

Final PCN Issue Date

X

Estimated Implementation Date

X

Method to Identify Change:  
Traceability code

Qualification Report:
Please open the attachments included with this PCN labeled as PCN_#_Qual Report.

Revision History:
August 20, 2019: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on September 20, 2019.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.



Please contact your local Microchip sales office with questions or concerns regarding this notification.

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