Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

Product Change Notification - GBNG-05QUVX037   (Convert To PDF)


Date:
04 Mar 2019
Product Category:
8-bit Microcontrollers
Affected CPNs:
  
Notification subject:
CCB 3496 and 3496.001 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel products of the 35.4K, 35.5K and 35.9K wafer technologies available in 64L TQFP (14x14x1.0mm) and 100L TQFP (14x14x1.0mm) packages.
Notification text:

PCN Status:  
Final notification

PCN Type:  
Manufacturing Change

Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.

NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls). 

Description of Change: 
Qualification of MMT as an additional assembly site for selected Atmel products of the 35.4K, 35.5K and 35.9K wafer technologies available in 64L TQFP (14x14x1.0mm) and 100L TQFP (14x14x1.0mm) packages.

Pre Change: 
Assembled in ASE using Au, PdCu or CuPdAu wire, CRM-1076WA or 2288A die attach, G631H mold compound and C7025 lead frame material or assembled in LPI using Au or CuPdAu wire, CRM-1033BF die attach, G700 mold compound and C194 lead frame material or assembled at ANAP using AuPd or PdCu wire, 3200 or AP4200 die attach, G700, G770Y or G631HQ mold compound and C194 lead frame material.

Post Change:
Assembled in ASE using Au, PdCu or CuPdAu wire, CRM-1076WA or 2288A die attach, G631H mold compound and C7025 lead frame material or assembled in LPI using Au or CuPdAu wire, CRM-1033BF die attach, G700 mold compound and C194 lead frame material or assembled at ANAP using AuPd or PdCu wire, 3200 or AP4200 die attach, G700, G770Y or G631HQ mold compound and C194 lead frame material or assembled in MMT using Au wire, 3280 die attach, G700 mold compound and C194 lead frame material.

Pre and Post Change Summary:

Pre Change

Post Change

Assembly Site

ASE Inc. Taiwan (ASE)

Lingsen Precision Industries, LTD. (LPI)

Amkor Technology Philippine (P1/P2), INC. (ANAP)

ASE Inc. Taiwan (ASE)

Lingsen Precision Industries, LTD. (LPI)

Amkor Technology Philippine (P1/P2), INC. (ANAP)*

Microchip Technology Thailand (Branch) (MMT)

Wire material

Au

PdCu

CuPdAu

Au

CuPdAu

AuPd

PdCu

Au

PdCu

CuPdAu

Au

CuPdAu

AuPd

PdCu

Au

Die attach material

2288A

CRM-1076WA

CRM-1033BF

3230

AP4200

2288A*

CRM-1076WA

CRM-1033BF

3230

AP4200

3280

Molding compound material

G631H

G700

G700

G770Y

G631HQ

G631H

G700

G700L

G770Y

G631HQ

G700

Lead frame material

C7025

C194

C194

C7025

C194

C194

C194

MSL Classification

MSL 3

MSL 3

MSL 3

MSL 3

MSL 3

MSL 3

MSL 3

Impacts to Data Sheet:  
None

Change Impact:
None

Reason for Change:
To Improve on-time delivery performance by qualifying MMT as an additional assembly site.

Change Implementation Status:
In Progress 

Estimated First Ship Date:
For 100L TQFP package: January 19, 2019 (date code: 1903)
For 64L TQFP package: March 30, 2019 (date code: 1913)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Time Table Summary:

August 2018

->

December 2018

January 2019

February 2019

March 2019

Workweek

31

32

33

34

35

48

49

50

51

52

01

02

03

04

05

06

07

08

09

10

11

12

13

Initial PCN Issue Date

X

Qual Report Availability

X

Final PCN Issue Date

X

Estimated Implementation Date

X

X*

*For 64L TQFP package

Method to Identify Change:   
Traceability code

Qualification Report:
Please open the attachments included with this PCN labeled as PCN_#_Qual Report. 

Revision History:
August 09, 2018: Issued initial notification.
December 19, 2018: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on January 19, 2019.
March 4, 2019: Re-issued final notification to update the subject and description because of the update in scope to include 64L TQFP package. Updated the affected CPN list in accordance with the update to the scope. Updated the pre and post change summary table MSL classification for MMT site from MSL 1 and 2 to MSL 3. Updated the pre and post change to add ANAP assembly site which is applicable for 64L TQFP package.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.



Please contact your local Microchip sales office with questions or concerns regarding this notification.

Terms and Conditions:

If you wish to receive Microchip PCNs via email please register for our PCN email service at our PCN home page select register then fill in the required fields. You will find instructions about registering for Microchips PCN email service in the PCN FAQ section.  

If you wish to change your PCN profile, including opt out, please go to the PCN home page select login and sign into your myMicrochip account. Select a profile option from the left navigation bar and make the applicable selections.