Final notification (Addendum)
Microchip Part#s Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of masks YPAAx and TDAAx at an additional wafer fabrication site.
Impacts to Data Sheet:
Reason for Change:
To Improve production cycle time and on-time delivery performance
Change Implementation Status:
Estimated First Ship Date:
YPAAx mask: July 29, 2011 (Date code1131)
TDAAx mask: September 25, 2013 (Date code 1426)
NOTE: Please be advised that after the first ship date customers may receive the affected products from any qualified wafer fab.
Markings to Distinguish Revised from Unrevised Devices:
March 31, 2011: Issued initial notification for qualifying YPAAx mask at an additional wafer fabrication site.
August 25, 2011: Issued final notification for qualification of YPAAx mask at an additional fabrication site with attached qualification report and revised estimated first ship date.
July 23, 2012: No changes made to PCN.
June 25, 2013: Revised PCN to add TDAAx mask qualifies by similarity to YPAAx mask. Revised parts affected list to include all products linked to the TDAAx mask. Added the TDAAx estimated first ship date. Revised the qualification report to add that the TDAAx mask qualifies by similarity to YPAAx.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.